Industrial Plasma Engineering: Volume 2: Applications to Nonthermal Plasma Processing, Volume 2Written by a leading expert in the field, Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices tha |
Contents
| 1 | |
Atmospheric Pressure Plasma Sources | 37 |
Vacuum Plasma Sources | 74 |
Plasma Reactors for Plasma Processing | 113 |
Specialized Techniques and Devices for Plasma Processing | 196 |
Parametric Plasma Effects On Plasma Processing | 240 |
Diagnostics for Plasma Processing | 284 |
Plasma Treatment of Surfaces | 335 |
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Industrial Plasma Engineering: Volume 2: Applications to ..., Volume 2 J Reece Roth No preview available - 2001 |
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active species addition adhesion angle applications approximately argon atmospheric atoms cathode chapter characteristic charge circuit coatings collisions configuration corona dependence deposition direction discussed discussed in section effect electric field electron energetic energy equation etching etching rate example exposure fabrics flow flux frequency function gas flow gases given glow discharge plasma illustrated in figure improve incident increase indicated inductive industrial input ion beam ion implantation ionization layer magnetron mass material mean measured metal methods microelectronic microwave negative normally occurs operating parallel-plate parameters PCVD plasma processing plasma reactor plasma sources plate polymeric polymers potential POWER SUPPLY pressure produce pumping range reaction reactor regime relatively removed resistance result RF POWER sheath shown in figure silicon sputtering substrate surface energy temperature thermal thickness thin films Torr uniformity usually VACUUM PUMPS vacuum system voltage Volume wafer widely workpiece yield