Industrial Plasma Engineering: Volume 2 - Applications to Nonthermal Plasma Processing

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CRC Press, Aug 25, 2001 - Science - 658 pages
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Written by a leading expert in the field, the paperback edition of Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices that are of commercial interest. The text is suitable for students or in-service users with a physics and calculus background at the sophomore level. These two volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines and as a reference source by in-service engineers.
 

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Revisar pag 285, contiene entradas y salidas del sistema de plasma

Contents

Surface Modification by Implantation and Diffusion
399
ThinFilm Deposition by Evaporative Condensation
451
Plasma Chemical Vapor Deposition PCVD
502
Plasma Etching
540
Appendices
614
B Physical Constants
623
Introduction 1
ix
Contents
xi
Specialized Techniques and Devices for Plasma Processing 196
196
Ionizing Radiation Sources 223
223
Dark Electrical Discharges in Cases 237
237
Parametric Plasma Effects On Plasma Processing 240
240
Diagnostics for Plasma Processing 284
284
Plasma Treatment of Surfaces 335
335
Inductive RF Electrical Discharges in Gases 391
391
Surface Modification by Implantation and Diffusion 399
399

Surface Interactions in Plasma Processing 1
1
Kinetic Theory of Gases 34
34
Atmospheric Pressure Plasma Sources 37
37
Motion of Charges in Electric and Magnetic Fields 54
54
Characteristics of Plasma 117
69
Vacuum Plasma Sources 74
74
Plasma Reactors for Plasma Processing 113
113
Electron Sources and Beams 159
159
Ion Sources and Beams 189
189
Capacitive RF Electrical Discharges in Gases 417
417
ThinFilm Deposition by Evaporative Condensation
451
Microwave Electrical Discharges in Gases 464
464
Plasma Chemical Vapor Deposition PCVD 502
502
Plasma Etching 540
540
Appendices 614
614
B Physical Constants 623
623
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About the author (2001)

Roth, University of Tennessee, Knoxville.

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